Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2017-12-22 14:51
441
Company Profile
Shenzhen Xinjiaye Electronics Technology Co., Ltd.By certification [File Integrity]
Contact:Mr. Gailpeng(Mr.)
Email:
Telephone:
Phone:
Area:Guangdong
Address:Guangdong
Website: http://xjypcb.hzxymbj.com/
Place of Origin: | Guangdong China (Mainland) |
Brand Name: | XJY | Model Number: | xjy-pcb 160 |
Base Material: | FR-4/aluminum PCB, fr-4,cem-1,cem-3 |
Copper Thickness: | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness: | 1.6mm-3.2mm, 0.2mm-4.5mm |
Min. Hole Size: | 0.2mm(8mil) |
Min. Line Width: | 0.1mm(4mil) |
Min. Line Spacing: | 0.1mm(4mil) |
Surface Finishing: | gold plate/hasl/carbon oil, gold plated |
Type: | Pcb copy |
Layer: | 1-24layers |
MAX.Board Size: | 800*550 |
Solder Mask: | green/red/blue/white/yellow |
Min.Line Width: | 0.1mm(4mil) |
Min.Line Space: | 0.1mm(4mil) |
Min.Hole Size: | 0.2mm |
Features
* Low water absorption rate
* Hard to be deformed
* High mechanical strength
* Good electric performance wether under the moist or dry environment, Flame retardant grade could reach 94-V0
* High temperature resistant,high dielectric performance and mechanical processing performance.
PCB manufacture and PCB assembly
* PCB board file with parts list provided by customer
* PCB board made, circuit board parts purchased by us
* PCB board with parts assembled
* Electronic testing circuit board or PCB
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
Testing procedures
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
*AOI (Automated Optical Inspection)
Technology capability
Items | Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
Finished Board Size | Max Double-sided Board | 640mm χ 1100mm | |
Max Multilayer Board | 640mm χ 1100mm | ||
Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
Min Conductor Spacing | 0.01mm | ||
Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
Nickl/Gold Thickness | For customer special need | ||
Nickl Plating Layer | >2um | ||
Gold Plating Layer | >0.3um | ||
Bare Board Test | Single Side Test | Max Test Point | 20480 |
Max Board Test Size | 400mm χ 300mm | ||
Double Side Test | Max Test Point | 40960(General Use) | |
4096(Special Use) | |||
Max Board Test Size | 406mm χ 325mm | ||
320mm χ 400mm | |||
Min Test pitch of SMT | 0.5mm | ||
Test Voltage | 10-250V | ||
Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
Angle Tolerance | ± 5° | ||
Deepness Tolerance | ± 0.20mm | ||
V-Cut Angle | 20°, 30°, 45° | ||
Board Thickness | 0.1-3.2mm | ||
Residues Thickness | ± 0.025mm | ||
Cell Paraposition Precision | ± 0.025mm | ||
Tolerance of Out-shape Process | ± 0.1mm | ||
Board Warp | Max Value | 0.7% | |
Optical Plotting | Max Plotting Area | 66mm χ 558.8mm | |
Precision | ± 0.01mm | ||
Repetitive Precision | ± 0.005mm |